Production Facility
Production Capacity

※ Dry Inlay: 60M/Month

※ Wet Inlay: 50M/Month

※ RFID Label: 45M/Month

Coming Plan

◆ 40-50 inverted flip chip bonding wire.

◆ Production capacity 4 billion/year.

Device Type

Device Model

Quantity

Flip Chip Bonding
Muehlbauer (TAL9K)1
Muehlbauer (TAL15K)6
Muehlbauer (DDA20K)1

Muehlbauer (DDA40K)

3
XJL(DZJ-10000)2
Converting
Muehlbauer (CL-60K)2
XJL(FH10000B)1
Feldbaum(MC250)1
Performance Tester (Voyantic)
CL3224
Tagformance1
Die ShearDage40001
Committed To

◆ R&D, manufacture and application of niche, scene-oriented RFID and IoT tags

◆ R&D, promoting IoT solutions based on sensing and auto identification technologies

◆ Focus on RFID applications for automotive, medical, logistics, anti-counterfeiting etc.